Microchip Technology India Pvt Ltd

Sr. Tech Staff Eng-Reliability (BB-060C6)

Found in: Neuvoo Bulk CA

Description:
Job Attributes Job Id 10364 Req Id 178-20 Category Engineering Job Type Full-time Education Level N/A Job Level Experienced Team Leader Hires Needed 1 Job Location Burnaby, Nationwide Share this on Sr. Tech Staff Eng-Reliability Burnaby, Nationwide Company Description Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM). We also license Flash-IP solutions that are incorporated in a broad range of products. Job Description Microchips fast-growing Ethernet and Data Center products group is looking for an Experienced Senior Reliability Design Engineer to help bring new products to market. Based in Microchip Technologys headquarters in Chandler Arizona, you would be part of our Corporate Reliability Engineering team tasked with supporting the development of all new products. In addition, you will participate in shaping and influencing our overall Corporate Reliability strategies and techniques. New team member will be interacting with executive and technical leadership. This position is a Senior Level Staff Engineering role (level below Technical Fellow) and is considered Technical Leadership track. Hands on experience solving challenging design reliability issues associated with advanced technologies. Understanding of reliability design (DFR) and impact on 28nm HKMG and 16nm FinFET technologies. Knowledge of advanced packaging and design. Knowledge of new interconnects/materials/processes such as ELK(extreme low k), Cu wire, Pb free solder bumps, Oblong Cu bumps, micro Cu pillar bumps, TSV(through Si via), Cu/Cu hybrid bonding, very high density BU(build up) substrates and thin core and coreless substrates. Experience working on a Product Development team (Product and Design engineering) to support the development and qualification of new products and reliability stress plans. Participate on various industry councils and committees. Must possess good communication and writing skills. Must be able to work independently and in group settings. Operate effectively in a team environment while contributing to the organizations success. Job Requirements Education & Experience Requirements PhD degree in Physics/Electrical/Computer or related engineering or technical field with minimum of 10 years industry experience. Or MS Physics/Electrical/Computer with 15 direct experience required. Strong understanding of fundamentals of transistor level integrated circuits and device physics. General understanding of qualification methods including Package Rel, Activation Energies, HTOL, HAST, T/C and Endurance testing. Experience with statistical methods, tools and creation of process models, helpful. Additional Requirements & Qualifications Self-motivated and take ownership for solutions Strong communication and teamwork skills Must adhere to Microchips guiding values Travel 15 PERCENT or less

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