- The successful candidate will manage development activities with customers, leveraging their extensive knowledge of IC package design environments and trade-offs.
Senior Technical Lead - Advanced Packaging Solutions - Strong Township - beBeeSemiconductor
Job title: Director, Chiplets/FCBGA Integration (28895)
Description
Job Overview
We are seeking a seasoned professional to lead our Chiplet/FCBGA Integration program. This is an exciting opportunity for individuals with expertise in semiconductor packaging and test services.
Key Responsibilities
This role requires strong leadership skills, excellent communication abilities, and a deep understanding of semiconductor technology. The ideal candidate will have experience managing cross-functional teams, driving project execution, and fostering collaboration among stakeholders.