Director, Chiplets - Strong Township - Amkor Technology

    Amkor Technology
    Amkor Technology Strong Township

    1 week ago

    Description
    A global leader in semiconductor packaging is seeking a Director, Chiplets and FCBGA for their Tempe, AZ office.

    This hybrid role involves program management for advanced chiplet-based IC Packages, requiring over 10 years of experience in semiconductor package development.

    Responsibilities include managing customer interactions, leading project teams, and ensuring successful product management through development and production.

    The ideal candidate must have a Bachelor's Degree in Engineering and deep knowledge of IC packaging materials and design trade-offs.

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