Advanced Packaging Engineer - Ottawa
1 week ago

Job description
, consectetur adipiscing elit. Nullam tempor vestibulum ex, eget consequat quam pellentesque vel. Etiam congue sed elit nec elementum. Morbi diam metus, rutrum id eleifend ac, porta in lectus. Sed scelerisque a augue et ornare.
Donec lacinia nisi nec odio ultricies imperdiet.
Morbi a dolor dignissim, tristique enim et, semper lacus. Morbi laoreet sollicitudin justo eget eleifend. Donec felis augue, accumsan in dapibus a, mattis sed ligula.
Vestibulum at aliquet erat. Curabitur rhoncus urna vitae quam suscipit
, at pulvinar turpis lacinia. Mauris magna sem, dignissim finibus fermentum ac, placerat at ex. Pellentesque aliquet, lorem pulvinar mollis ornare, orci turpis fermentum urna, non ullamcorper ligula enim a ante. Duis dolor est, consectetur ut sapien lacinia, tempor condimentum purus.
Access all high-level positions and get the job of your dreams.
Similar jobs
About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. · At Marvell, you can affec ...
1 day ago
About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. · At Marvell, you can affe ...
1 week ago
+About MarvellMarvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorro ...
1 month ago
This is an existing vacancy for a Packaging Engineer at Marvell. · Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design. · ...
1 month ago
· Job#80142 · Job Purpose · The Microelectronic Design Engineering team, as part of our company's Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in mic ...
1 week ago
We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases. ...
1 month ago
Requisition ID: · Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testi ...
1 week ago
Develops and implements production/processing methods and controls to meet quality standards in the most efficient manner for Photonic and Electronic Advanced Packaging. · ...
1 month ago
We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases. ...
1 month ago
The Microelectronic Design Engineering team represents one of the key strategic growth areas of Sanmina's total engineering service offering. · ...
1 month ago
This is a full-time, on-site role for an Advanced Packaging Engineer designing advanced packaging solutions.Experience in advanced silicon packaging. · Mechanical, thermal and FEA modeling experience. · Proven track-record of product development from concept through volume produc ...
1 month ago
We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, · Select microelectronic technologies and definition of design concepts, · Design microelectronic packages & modules, · Contribute to microele ...
1 month ago
We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs. · Select microelectronic technologies and definition of design concepts. · ...
1 month ago
Join our team as a Microelectronic Packaging Design Engineer and support technology and product development programs. · Select microelectronic technologies and definition of design concepts based on product applications requirements specifications. · Design microelectronic packag ...
1 month ago
This role involves developing production/processing methods to meet quality standards in photonic and electronic advanced packaging. · ...
1 month ago
We are looking for a skilled software engineer who can contribute to the Swift package ecosystem.Your work will directly impact developers worldwide, enabling them to build applications with strong security, high performance, and great reliability. · ...
1 month ago
We are looking for a skilled software engineer who can contribute to the Swift package ecosystem. Your work will directly impact developers worldwide, enabling them to build applications with strong security, high performance, · and great reliability.In this role your primary res ...
1 month ago
We are looking for a Senior Staff Package Design Engineer to join our team. Ensuring Synopsys IP test chip packages meets performance requirements and helps customers explore their package solution space options with Synopsys IPs. · Minimum of 10+ years of relevant experience · B ...
1 month ago
+We are looking for a Senior Staff Package Design Engineer to join our team at Synopsys. · +Early design stage collaboration to optimize and define requirements for SI&PI performance (e.g., bump maps) · Support package designs per year · Help customers explore their package solut ...
1 month ago
+We are looking for a Senior Staff Package Design Engineer to join our team. · +Early design stage collaboration to optimize and define requirements for SI&PI performance (e.g., bump maps) · Support5:7PHY Test Chip Package designs per year · Help customers explore their package s ...
1 month ago