IC Package Design Engineer — Hybrid, Tempe - Strong Township - Amkor Technology

Description

A global leader in semiconductor solutions is seeking an IC Package Design Engineer to create high-quality designs and detailed engineering drawings.

This position involves verifying design rules, collaborating with product and sales teams, and improving design technologies. Candidates should hold a Bachelor's degree in Electrical or Mechanical Engineering, have CAD experience, and strong communication skills. The role is hybrid, and residency near the office is required.
#J-18808-Ljbffr