Director, Advanced Chiplet - Strong Township - Amkor Technology

    Amkor Technology
    Amkor Technology Strong Township

    1 week ago

    Description
    A global semiconductor packaging leader is recruiting for a Business Unit Product Manager for Advanced FCBGA Packaging. This role, based in Tempe, AZ, involves program management and customer account management, driving internal process improvements. The candidate will have a Bachelor's degree in Engineering, 10+ years in semiconductor packaging, and experience in project management. The position offers a hybrid schedule, and candidates must be willing to relocate if necessary.
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