Optical Packaging Designer - Ottawa, Ontario

Credo is seeking an Optical Packaging Designer to design and develop advanced packaging solutions for photonic devices and optical components that power next-generation communication systems and high-performance computing. · ...

We are seeking an Optical Packaging Designer to design and develop advanced packaging solutions for photonic devices and optical components that power next-generation communication systems and high-performance computing. · ...

We are seeking an Optical Packaging Designer to design and develop advanced packaging solutions for photonic devices and optical components that power next-generation communication systems and high-performance computing. · Design and implement optomechanical package and modules f ...

· Job#80142 · Job Purpose · The Microelectronic Design Engineering team, as part of our company's Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in mic ...

Requisition ID: · Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testi ...

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases. ...

+Our approach to internship is to make the successful candidate an integral part of our team. · +Design of IC chip carriers contained in either electronic components or pluggable modulesCircuit layout of mini-panels containing Semtech chips requiring a high density of high speed ...

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases. ...

The Microelectronic Design Engineering team represents one of the key strategic growth areas of Sanmina's total engineering service offering. · ...

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, · Select microelectronic technologies and definition of design concepts, · Design microelectronic packages & modules, · Contribute to microele ...

Join our team as a Microelectronic Packaging Design Engineer and support technology and product development programs. · Select microelectronic technologies and definition of design concepts based on product applications requirements specifications. · Design microelectronic packag ...

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs. · Select microelectronic technologies and definition of design concepts. · ...

This is a full-time, on-site role for an Advanced Packaging Engineer designing advanced packaging solutions.Experience in advanced silicon packaging. · Mechanical, thermal and FEA modeling experience. · Proven track-record of product development from concept through volume produc ...

We are looking for a Senior Staff Package Design Engineer to join our team. Ensuring Synopsys IP test chip packages meets performance requirements and helps customers explore their package solution space options with Synopsys IPs. · Minimum of 10+ years of relevant experience · B ...

+We are looking for a Senior Staff Package Design Engineer to join our team at Synopsys. · +Early design stage collaboration to optimize and define requirements for SI&PI performance (e.g., bump maps) · Support package designs per year · Help customers explore their package solut ...

+We are looking for a Senior Staff Package Design Engineer to join our team. · +Early design stage collaboration to optimize and define requirements for SI&PI performance (e.g., bump maps) · Support5:7PHY Test Chip Package designs per year · Help customers explore their package s ...

The Design Engineer Supervisor acts as a hands-on Design Engineer while overseeing a group of Design Engineers. · ...

· Job#81393 · Job Purpose · The Microelectronic Design Engineering team, as part of our company's Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in mic ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.  · At Marvell, you can affe ...

The Marvell packaging organization is responsible for supporting customers with advanced package designs that meet challenging electrical requirements. · Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experi ...